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PC3H510NIP0F 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc3h51 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. programmable controllers 2. facsimiles 3. telephones applications mini-flat half pitch package, darlington phototransistor output, low input current photocoupler 1. 4-pin mini-flat half pitch package (lead pitch : 1.27mm) 2. double transfer mold package (ideal for flow soldering) 3. low input current type (i f = 0.5ma) 4. darlington phototransistor output (ctr : min. 600% at i f = 0.5ma, v ce = 2v) 5. isolation voltage between input and output (v iso(rms) : 2.5kv) 6. lead-free and rohs directive compliant description PC3H510NIP0F contains a ired optically coupled to a phototransistor. it is packaged in a 4-pin mini-flat, half pitch type. input-output isolation voltage(rms) is 2.5kv. ctr is min. 600% at input current of 0.5ma. 1 sheet no.: d2-a02302en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. ? 4-channel package type is also available. (model no. pc3q510nip0f ) PC3H510NIP0F
internal connection diagram anode cathode emitter collector 1 2 3 4 1 2 4 3 2 sheet no.: d2-a02302en outline dimensions (unit : mm) 1 anode mark sharp mark "s" date code 2.6 0.3 1.27 0.25 2 h 5 1 4 3 4.4 0.2 0.4 0.1 5.3 0.3 (1.7) 0.2 0.05 7.0 + 0.2 ? 0.7 0.5 + 0.4 ? 0.2 0.1 0.1 2.0 0.2 epoxy resin *( ) : reference dimensions PC3H510NIP0F product mass : approx. 0.05g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a02302en country of origin japan rank mark there is no rank mark indicator. PC3H510NIP0F
sheet no.: d2-a02302en electro-optical characteristics parameter conditions forward voltage reverse current terminal capacitance collector dark current transfer charac- teristics current transfer ratio collector-emitter saturation voltage collector-emitter breakdown voltage emitter-collector breakdown voltage isolation resistance min. ? ? ? ? 6 ? 5 10 10 ? typ. 1.2 ? 30 ? ? ? ? 1 10 11 53 max. 1.4 10 250 1000 ? ? 1.0 ? 250 unit v v a pf na v ma 31460 v ? s s symbol v f i r c t i ceo bv ceo bv eco i c v ce (sat) r iso t f response time rise time fall time input output i f = 5ma v r = 4v v = 0, f = 1khz v ce = 10v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 0.5ma, v ce = 2v dc500v, 40 to 60%rh v ce = 2v, i c = 10ma, r l = 100 ? ? 60 300 t r floating capacitance ? 0.6 1.0 c f pf v = 0, f = 1mhz i f = 1ma, i c = 2ma 35 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current ma power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 10 200 15 reverse voltage v v r 6 35 6 80 150 170 ? 30 to + 100 ? 40 to + 125 260 2.5 kv 4 PC3H510NIP0F
sheet no.: d2-a02302en total power dissipation p tot (mw) 200 170 150 250 100 50 0 ? 30 0 25 50 75 100 125 ambient temperature t a (?c) fig.4 total power dissipation vs. ambient temperature peak forward current i fm (ma) 1 000 100 10 10 ? 3 10 ? 2 10 ? 1 1 duty ratio pulse width 100 s t a = 25?c fig.5 peak forward current vs. duty ratio forward current i f (ma) 0 10 ? 30 0 25 50 75 100 125 ambient temperature t a (?c) 5 15 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) 15 10 5 0 ? 30 0 25 50 75 100 125 ambient temperature t a (?c) fig.2 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) 200 150 250 100 50 0 ? 30 0 25 50 75 100 125 ambient temperature t a (?c) fig.3 collector power dissipation vs. ambient temperature 5 PC3H510NIP0F 50?c 25?c 0?c 0 0.5 1 1.5 2 1 10 100 0.1 ? 25?c t a = 100?c forward current i f (ma) forward voltage v f (v) t a = 75?c fig.6 forward current vs. forward voltage
sheet no.: d2-a02302en 100 120 0 40 60 80 20 140 relative current transfer ratio (%) ambient temperature t a (?c) 0102 030405060708090100 ? 30 ? 20 ? 10 i f = 0.5 ma v ce = 2v fig.10 relative current transfer ratio vs. ambient temperature fig.8 collector current vs. forward current 0 0.2 ? 30 0 ? 10 ? 20 20 10 50 40 30 70 60 80 90 100 0.4 0.6 0.8 1 1.2 collector-emitter saturation voltage v ce (sat) (v) ambient temperature t a (?c) i f = 1 ma i c = 2 ma fig.11 collector - emitter saturation voltage vs. ambient temperature 6 0 0 20 1 40 60 80 100 120 2345 collector current i c (ma) collector-emitter voltage v ce (v) i f = 7.0ma pc(max) i f = 5.0ma i f = 3.0ma i f = 2.0ma i f = 1.0ma i f = 0.7ma i f = 0.5ma t a = 25 ?c fig.9 collector current vs. collector-emitter voltage 0 0.1 current transfer ratio ctr (%) 4 000 110 3 000 2 000 1 000 500 1 500 2 500 3 500 forward current i f (ma) v ce = 2v t a = 25?c fig.7 current transfer ratio vs. forward current 0.1 0.1 1 10 1 10 100 collector current i c (ma) forward current i f (ma) v ce = 2 v t a = 25?c PC3H510NIP0F 10 20 30 40 ? 20 ? 10 0 50 60 70 80 90 100 collector dark current i ceo (a) ambient temperature t a (?c) ? 30 10 ? 10 10 ? 9 10 ? 8 10 ? 7 10 ? 6 10 ? 5 10 ? 4 v ce = 10 v fig.12 collector dark current vs. ambient temperature
sheet no.: d2-a02302en 7 0.01 0.1 1 1 000 10 1 100 10 response time ( s) t s t d t f t r load resistance r l (k ? ) v ce = 2v i c = 10ma t a = 25?c fig.13 response time vs. load resistance remarks : please be aware that all data in the graph are just for reference and not for guarantee. PC3H510NIP0F 10% 90% output input input output r l v cc r d t s t d t r t f please refer to the conditions in fig.13 fig.14 test circuit for response time
sheet no.: d2-a02302en design considerations while operating at i f <0.5ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 8 1.5 1.27 0.8 6.3 (unit : mm) design guide PC3H510NIP0F
sheet no.: d2-a02302en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 260?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 9 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) PC3H510NIP0F
sheet no.: d2-a02302en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. cleaning instructions presence of odc 10 PC3H510NIP0F this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde).
sheet no.: d2-a02302en 11 package specification tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g l b h a c h 5? max. a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.5 0.1 i 0.3 0.05 j 2.3 0.1 k 3.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 l 1.6 + 0.1 ? 0 dimensions list (unit : mm) a c e g f b d a 330 b 13.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) pull-out direction [packing : 3 000pcs/reel] reel structure and dimensions direction of product insertion PC3H510NIP0F
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 12 sheet no.: d2-a02302en important notices PC3H510NIP0F [e205]

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